• Key features

    • Fanless Design with Corrugated Aluminum
    • Design for MIL-STD-810G with Extreme Operating Temperature
    • Vehicle Ignition Power Management
    • 3G Ring/SMS System Power On
    • 3G Voice Communication
    • Diversity of Digital Input/Output and Relay Support
    • Design for MIL-STD-810G with Extreme Vibration Resistance

Specifications

 

Platform
CPUIntel® Atom™ D2550 1.8GHz
ChipsetIntel® NM10
Memory TechnologyDDR3 SO-DIMM x1
Memory CapacityUp to 4GB
Storage
IDE storageCF socket Type I/II x1
SATA storageRemovable 2.5” HDD/SSD drive bay x1
I/O
Ethernet controllerIntel® 82583V x2
Graphic controllerIntel® GMA3650
Audio controllerRealtek ALC886
Default LANGbE RJ45 x2
Display outputDB15 x 1 for VGA, DVI-D x 1, Optional LVDS (Integrating USB, 12V and remote power switch)
Audio ports1x Mic-in and Line-out (for PC); 1x Mic-in and Line-out (for 3G, optional)
Serial portsDB9 Male x2 supports RS-232/485; DB9 Male x1 supports RS-232
GPSUblox NEO-6Q
Digital I/O4x DI 12V Level, 3x DO 12V Level, 2x DI (from MCU) 3.3V Level, 1x 12/24V,2A relay
USB 2.04 x Type A
Power and Mechanical
Power input3-pin terminal block (+,-,ignition)
ExpansionMini-PCIe x3 with 2 SIM card readers
OthersExternal: 3x SMA antenna hole, 1x external SIM-card reader, 1xInternal SIM Card reader, Reset button, Power button, Remote power switch, 12V/1A DC out
ResetDC Input: 9~36V for +12V-level and +24V-level car battery with Ignition Control
Fan coolingFanless
Hardware monitorFintek 81865
OS and Certifications
Operating SystemXPE/WES2009, XP Pro FES,WS7E,Win 7 Pro FES
CertificationsCE, FCC Class A, RoHS, E13
ComplianceVibration, Shock: MIL-STD-810G
Physical and Environmental
Operating temperature-5°C to 45°C
Operating temperature (industrial components)-30°C to 60°C
Dimensions (W x H x D)268 mm x 188.2 mm x 56 mm (10.45″ x 7.34″ x 2.18″)

The information in this table can be changed without notice.

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